Method of manufacturing a complex product by an additive process

ABSTRACT

A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.

STATEMENT AS TO RIGHTS TO APPLICATIONS MADE UNDER FEDERALLY SPONSOREDRESEARCH AND DEVELOPMENT

The United States Government has rights in this application pursuant toContract No. DE-AC52-07NA27344 between the United States Department ofEnergy and Lawrence Livermore National Security, LLC for the operationof Lawrence Livermore National Laboratory.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a Division of U.S. Pat. No. 10,221,498, filedAug. 11, 2015, the disclosure of which is hereby incorporated byreference in its entirety for all purposes.

BACKGROUND Field of Endeavor

The present application relates to additive manufacturing and moreparticularly to additive manufacturing of a complex product.

State of Technology

This section provides background information related to the presentdisclosure which is not necessarily prior art.

U.S. Pat. No. 7,088,432 for dynamic mask projection stereo microlithography contains the state of technology information reproducedbelow.

The present invention uses micro stereolithography to provide a newmethod to fabricate 3D micro or nano structures that can be used for awide variety of devices such as micro/nano-electronics, biotechnology,MEMS, biomedical devices and in the manufacture of optical devices suchas lenses and mirrors. The invention is based on using advanced dynamicmask projection stereo micro-lithography on a photoresist to form alayer, building an object layer by layer, to achieve ceramicmicro-stereolithography for the first time. A 3D solid image, which maybe a model designed by CAD software at a PC, is sliced into a series of2D layers, each 2D layer being displayed at the dynamic mask viamicro-mirror deflections projected onto the photoresist.

U.S. Pat. No. 6,258,237 for electrophoretic diamond coating andcompositions for affecting same contains the state of technologyinformation reproduced below.

The present invention is of method and composition which can be used thefabrication of diamond coatings or free standing products. Specifically,the present invention can be used for the fabrication of such coatingsunder ambient temperature and pressure conditions, in increased growthrate, featuring improved thickness control and uniformity on irregularshapes, over a variety of substrate materials. Most specifically, thepresent invention can be used for the fabrication of such coatings onthe surface of substrates, such as of milling cutters, bites (inserts),end mills and drills each having an excellent scale-off (or peeling-off)resistance, various abrasion (wear) resistant members such as valves andbearings, and substrates acting as heat sinks for electronic parts.

U.S. Pat. No. 5,099,311 for a microchannel heat sink assembly containsthe state of technology information reproduced below.

Heat generation is a common problem with semiconductor devices such asintegrated circuits. Temperature buildup can reduce the lifetime ofsemiconductor components, change their electrical characteristics, andat high temperatures, sufficiently degrade the semiconductor junction torender the circuit useless. Most consumer electronic devices rely onpassive cooling, or use fans to cool electrical components. However,these cooling means are inadequate for high performance circuits, suchas those that must dissipate a very large amount of power, or forclosely packed circuits, or circuits that are designed to functionextremely quickly. In such circuits, heat buildup is a factor that canlimit system performance. If available, a more aggressive, more powerfulcooling means can be used to provide better performance. Active coolingmeans, including forced coolant flow systems, have been used withintegrated circuits. For example, a so-called “thermal conductionmodule”, comprising a complicated structure including pistons andsprings, is presently used in IBM products. Microchannels, which aresmall microscopic channels formed in silicon wafers, have been disclosedto be effective heat sinks for integrated circuits. When a coolant isforced through such microchannel coolers, it has been demonstrated thata large amount of heat can be removed from a small area. For example,Tuckerman, in U.S. Pat. No. 4,573,067 discloses a semiconductor chipincluding microscopic channels defined by fins in intimate contact withthe chip. The microscopic channels are enclosed by a cover, to enclosethe channels. Fluid flow through the channels is disclosed to beapproximately laminar. Microchannels themselves have received muchattention. However, little attention has been focused on the means fordelivery of coolant to the microchannels.

SUMMARY

Features and advantages of the disclosed apparatus, systems, and methodswill become apparent from the following description. Applicant isproviding this description, which includes drawings and examples ofspecific embodiments, to give a broad representation of the apparatus,systems, and methods. Various changes and modifications within thespirit and scope of the application will become apparent to thoseskilled in the art from this description and by practice of theapparatus, systems, and methods. The scope of the apparatus, systems,and methods is not intended to be limited to the particular formsdisclosed and the application covers all modifications, equivalents, andalternatives falling within the spirit and scope of the apparatus,systems, and methods as defined by the claims.

The inventor's apparatus, systems, and methods produce a complex productby designing a three dimensional preform of the complex product;creating a three dimensional preform of the complex product; depositinga material on the preform; and removing the preform to produce thecomplex product. In one embodiment, the inventor's apparatus, systems,and methods produce a complex product by designing a three dimensionalpreform of the complex product; creating a three dimensional preform ofthe complex product; depositing a metal and non-metal on the preform;and removing the preform to produce the complex product. In anotherembodiment, the inventor's apparatus, systems, and methods produce acomplex product by designing a three dimensional preform of the complexproduct; creating a three dimensional preform of the complex product;depositing a material that incudes metal on the preform; and removingthe preform to produce the complex product. In yet another embodiment,the inventor's apparatus, systems, and methods produce a complex productby designing a three dimensional preform of the complex product;creating a three dimensional preform of the complex product; depositinga material that incudes metal and non-metal on the preform; and removingthe preform to produce the complex product. In another embodiment, theinventor's apparatus, systems, and methods produce a complex product bydesigning a three dimensional preform of the complex product; creating athree dimensional preform of the complex product; using electrophoreticdeposition for depositing diamond nanoparticles on the preform and usingelectroplating for depositing copper nanoparticles on the preform; andremoving the preform to produce the complex product.

The inventor's apparatus, systems, and methods have use producing acomplex product. In one embodiment the inventor's apparatus, systems,and methods have use producing a complex heat sink. The heat sink hasuse in heat dissipation in power electronics, light emitting diodes andmicrochips. The heat sink has use in temperature regulation of asubstrate. In other embodiments the inventor's apparatus, systems, andmethods have use in producing complex heat pipes, micro-thrusters,micro-combustion chambers for propulsion systems, micro-nozzles foraerodynamic separation of gases, and microscale chemical synthesisreactors or analysis systems also known as lab-on-a-chip devices

The apparatus, systems, and methods are susceptible to modifications andalternative forms. Specific embodiments are shown by way of example. Itis to be understood that the apparatus, systems, and methods are notlimited to the particular forms disclosed. The apparatus, systems, andmethods cover all modifications, equivalents, and alternatives fallingwithin the spirit and scope of the application as defined by the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated into and constitute apart of the specification, illustrate specific embodiments of theapparatus, systems, and methods and, together with the generaldescription given above, and the detailed description of the specificembodiments, serve to explain the principles of the apparatus, systems,and methods.

FIG. 1 is a flow chart illustrating the inventor's apparatus, systems,and methods for producing a complex product.

FIG. 2 illustrates a stereo micro lithography system for preparing thepreform for the inventor's apparatus, systems, and methods for producinga complex product.

FIG. 3A illustrates one embodiment of a three dimensional preform of thecomplex product.

FIG. 3B illustrates an example of a three dimensional preform of acomplex micro heat sink.

FIGS. 4A, 4B, 4C, and 4D illustrate one embodiment of the inventor'smethod for producing a complex product.

FIG. 5 illustrates one embodiment of the inventor's system fordepositing a material on the preform.

FIG. 6 illustrates one embodiment of a three dimensional complex productproduce by the inventor's system.

FIGS. 7A and 7B illustrate another embodiment of a three dimensionalcomplex product produce by the inventor's system.

FIGS. 8A, 8B, and 8C illustrate a complex micro heat pipe productproduce by the inventor's system.

FIG. 9 illustrates a complex micro gas nozzle system produce by theinventor's method.

FIG. 10 is a flow chart illustrating another embodiment of theinventor's apparatus, systems, and methods for producing a complexproduct.

FIGS. 11A, 11B, and 11C illustrate an embodiment of the inventor'smethod for producing a complex heat sink product.

FIG. 12 is a flow chart illustrating yet another embodiment of theinventor's apparatus, systems, and methods for producing a complexproduct.

DETAILED DESCRIPTION OF SPECIFIC EMBODIMENTS

Referring to the drawings, to the following detailed description, and toincorporated materials, detailed information about the apparatus,systems, and methods is provided including the description of specificembodiments. The detailed description serves to explain the principlesof the apparatus, systems, and methods. The apparatus, systems, andmethods are susceptible to modifications and alternative forms. Theapplication is not limited to the particular forms disclosed. Theapplication covers all modifications, equivalents, and alternativesfalling within the spirit and scope of the apparatus, systems, andmethods as defined by the claims.

The inventor's apparatus, systems, and methods produce a complex productby designing a three dimensional preform of the complex product;creating a three dimensional preform of the complex product; depositinga material on the preform; and removing the preform to produce thecomplex product. In one embodiment the inventor's apparatus, systems,and methods produce a complex product by designing a three dimensionalpreform of the complex product; creating a three dimensional preform ofthe complex product; depositing a material on the preform wherein thematerial includes metal; and removing the preform to produce the complexproduct. Examples of the metal include copper, aluminum, iron, nickel,silver, and other metals.

In another embodiment the inventor's apparatus, systems, and methodsproduce a complex product by designing a three dimensional preform ofthe complex product; creating a three dimensional preform of the complexproduct; depositing a material on the preform wherein the materialincludes metal and non-metal; and removing the preform to produce thecomplex product. Examples of the non-metal include diamonds, silicon,quartz, and other non-metals.

Modeling is used to design the three dimensional preform of the complexproduct. The modeling can be accomplished using computer aided design. Athree dimensional preform of the complex product is created using themodel. The three dimensional preform can be created by lithography,stereo micro lithography, and other methods. In different embodiments,the depositing of copper and diamonds on the preform includeselectrodeposition, electrophoretic deposition, and electrophoreticdeposition and plating for depositing a material including metal on thepreform. In one embodiment the inventor's system provides a complexmicrochannel heat sink. The heat sink can be used in heat dissipation inpower electronics, light emitting diodes and microchips. Due to the mildprocessing conditions, it is possible to build a heat sink with thismethod directly onto a semiconductor substrate.

The preform can be constructed out of any material that can besubsequently removed during the processing step. The materials caninclude polylactic acid, paralyene, acrylates, or waxes. Modeling isused to design the three dimensional preform of the complex productwhich can include micron and nanometer scale features. In differentembodiments the modeling includes computer aided design, lithography,and stereo micro lithography. In different embodiments, the depositingof copper and diamonds on the preform includes electrodeposition,electrophoretic deposition, and electrophoretic deposition and platingfor depositing a material including metal on the preform.

Referring to the drawing and in particular to FIG. 1, a flow chartillustrates the inventor's apparatus, systems, and methods for producinga complex product. The Inventor's apparatus, systems, and methods aredesignated generally by the reference numeral 100. As illustrated in theflow chart of FIG. 1, the inventor's system includes a number of steps.Designing a three dimensional preform of the complex product is step 1.Creating a three dimensional preform of the complex product is step 2.Depositing a material on the preform is step 3. Removing the preform tocomplete the complex product is step 4.

In step 1, designated by the reference numeral 102, modeling is used todesign the three dimensional preform of the complex product. Indifferent embodiments the modeling includes computer simulation,computer aided design and other modeling techniques. In step 2,designated by the reference numeral 104, a three dimensional preform ofthe complex product is created. In different embodiments the method ofcreation is lithography, stereo micro lithography, two photonlithography, fused deposition modeling, direct ink writing, and computernumerical control milling.

In step 3, designated by the reference numeral 106, the depositing of amaterial on the preform can include electrodeposition, electrophoreticdeposition, and electrophoretic deposition and plating for depositingcopper and diamonds on and around the preform. In one embodiment thedepositing of a material on the preform uses electrophoretic depositionand plating for depositing the material on the preform.

In step 4, designated by the reference numeral 108, the removal of thepreform can include thermal decomposition of the preform to remove thepreform to complete. For example, sintering the preform can be used toremove the preform to complete the complex product.

In one embodiment the Inventor's system provides a complex heat sink.The heat sink can be used in heat dissipation in power electronics,light emitting diodes and microchips.

The Inventor's apparatus, systems, and methods have use producing othercomplex products. In one embodiment the Inventor's apparatus, systems,and methods have use in producing complex heat pipes, micro-thrusters,micro-combustion chambers for propulsion systems, micro-nozzles foraerodynamic separation of gases, and microscale chemical synthesisreactors and analytical devices also known as lab-on-a-chip devices

As illustrated in step 2 of FIG. 1, several methods may be used tocreate the three dimensional preform of the complex product. Indifferent embodiments the modeling includes lithography, stereo microlithography, two photon lithography, fused deposition modeling, directink writing, and computer numerical control milling. FIG. 2 illustratesa stereo micro lithography system for preparing the preform for theinventor's apparatus, systems, and methods for producing a complexproduct is illustrated. The stereo micro lithography system isdesignated generally by the reference numeral 200. A series of steps areused in stereo micro lithography system 200.

In the first step 210, a computer generated image is produced. A 3Dsolid model is designed by any suitable method, e.g., by bit mapping orby computer aided design (CAD) software at a PC/controller. The model iselectronically sliced into series of 2-dimensional data files, i.e., 2Dlayers, each defining a planar cross section through the 3D preform ofthe complex product to be constructed, and which may be individuallystored.

In the next step, step 212, a digital image is projected. A Lcos chip isused for the projection.

The next step, step 214, is the projection of a UV beam.

The next step, step 216, uses a beam delivery system to produce a beamcontaining the preform image information.

The next step, step 218, uses a beam projection system to project thepreform image in focus at a particular plane in aphotoresist/photo-curable composition in a supporting container so thatthe actinic light preferentially exposes the desired layer to cure it.The projecting beam 220 is directed into the photoresist/photo-curablecomposition 224. After one layer is cured the composition and focusingoptics undergo relative movement by an elevator system 226 that movesthe cured layer down and a second layer of fresh photoresist is formedto be exposed. The layer-by-layer process continues until the 3D preformof the complex product 222 is completed. The 3D preform of the complexproduct 222 can be made of a polymer or other material adapted for usein additional processing steps.

Referring now to FIG. 3A, one embodiment of a three dimensional preformof the complex product is illustrated. The embodiment of a threedimensional preform is designated generally by the reference numeral 300a. The three dimensional preform 300 a includes a first matrix ofparallel preform micro channel segments 302 a and a second matrix ofparallel preform micro channel segments 304 a. The preform micro channelsegments 302 a and the micro channel segments 304 a are positionedperpendicular.

Referring now to FIG. 3B, art example of a three dimensional preform ofa complex micro heat sink is illustrated. The three dimensional preformof a complex micro heat sink is designated generally by the referencenumeral 300 b. The preform of a micro heatsink 300 b includes a firstheat transfer section 302 b. The first heat transfer section 302 bincludes a multiplicity of first preform of micro channels 308 b adaptedto contain a heat transfer fluid. The micro heatsink 300 b also includesa second heat transfer section 304 b spaced from the first heat transfersection. The second heat transfer section 304 b includes a multiplicityof second preform of micro channels 310 b adapted to contain the heattransfer fluid. A preform of a connection section 306 b is locatedbetween the first heat transfer section 302 b and the second heattransfer section 304 b.

FIGS. 4A, 4B, 4C and 4D are a series of figures that illustrate theinventor's method for producing a complex product. The method includesindividual steps used in designing a three dimensional complex product.

FIG. 4A illustrates a preform 402 used in designing a three dimensionalcomplex product. The three dimensional preform 402 includes a firstparallel matrix of preform micro channel segments 404 and a secondparallel matrix of parallel preform micro channel segments 406. Thepreform micro channel segments 404 and the preform micro channelsegments 406 are parallel to each other and spaced from each other. Aperpendicular matrix of preform micro channel segments 408 arepositioned in the space between preform micro channel segments 404 andthe preform micro channel segments 406. The preform micro channelsegments 408 are parallel to each other and perpendicular to the preformmicro channel segments 404 and the preform micro channel segments 406.

FIG. 4B illustrates the complex product after the step of depositing amaterial on the preform. The depositing of a material on the preform canbe accomplished using electrodeposition, electrophoretic deposition, orelectrophoretic deposition and plating. The preform micro channelsegments 404 and the preform micro channel segments 406 are showncovered with the material 410.

FIG. 4C illustrates the complex product after the step of removal of thepreform 402 leaving the void spaces 412. The material 410 with the voidspaces 412 forms the three dimensional complex product. The void spaces412 provide cooling fluid channels in the material 410.

FIG. 4D illustrates the complex product mounted on a semiconductorsubstrate 414. The complex product is made of the material 410 with thevoid spaces 412. The void spaces 412 provide cooling fluid channels inthe material 410. When the complex product is mounted on thesemiconductor substrate 414, the void spaces 412 provide fluid channelsfor a cooling fluid that cools the components on the semiconductorsubstrate 414.

Referring to FIG. 5, the inventor's system for depositing a material onthe preform is illustrated. The system is designated generally by thereference numeral 500. The depositing of a material on the preform canbe accomplished using electrodeposition, electrophoretic deposition,electrophoretic deposition and plating, and other methods of depositinga material.

The system 500 illustrated in FIG. 5 is a system that includes both (1)electrophoretic deposition and (2) electrophoretic deposition andplating. A deposition chamber 502 includes electrodes 504 and 506.Nanoparticle suspensions are introduced into the deposition chamber 502.The nanoparticle suspensions generally contain micron and/or nanometerscale particles. In one embodiment, the nanoparticle suspensions includecopper metal 508 and diamond particles 510. The copper metal 508 anddiamond particles 510 are deposited on the preform 512. In one operationof the system electrophoretic deposition is used to deposit the coppermetal 508 and diamond particles 510 on the preform 512. In anotheroperation electrophoretic deposition is used to deposit diamondparticles 510 on the preform 512 and plating is used to deposit thecopper metal 508 on the preform 512.

Referring now to FIG. 6, an example of a complex micro heat sink productis illustrated. The three dimensional micro heat sink is designatedgenerally by the reference numeral 600. The three dimensional micro heatsink product 600 includes a matrix of cooling micro channels 604 in acopper diamond body 602. The three dimensional micro heat sink product600 is produced by the steps of designing a three dimensional preform ofthe complex product, depositing copper and diamonds on the preform, andremoving the preform to complete the complex product. The finishedproduct can be bonded to a semiconductor substrate in step 4.

The depositing of copper and diamonds on the preform includeselectrodeposition, electrophoretic deposition, and electrophoreticdeposition and plating for depositing copper and diamonds on thepreform. In one embodiment the depositing copper and diamonds on thepreform uses electrophoretic deposition and plating for depositingcopper on the preform. The Inventor's heat sink has use in heatdissipation in power electronics, light emitting diodes and microchips.The heat sink has use in temperature regulation of a substrate.

Referring now to FIGS. 7A and 7B, one embodiment of a three dimensionalcomplex product is illustrated. FIG. 7A shows a complex micro heat sinkproduct produced by the Inventor's system and method. The main bodysection of the micro heatsink is identified by the reference numeral702. A laser diode bar 700 is shown positioned on the main body section702 of the micro heatsink. Heat is transferred from the laser diode bar700 to the heat sink. The main body section 702 includes a multiplicityof micro channels 704 adapted to channel a heat transfer fluid toprovide heat transfer from the main body section 702.

FIG. 7A shows a cut away portion of the micro heat sink. As shown inFIG. 7B, the laser diode bar 700 is positioned on the main body section702. Heat is transferred from the laser diode bar 700 to the main bodysection 702. A multiplicity of micro channels 704 are adapted to channela heat transfer fluid to provide heat transfer from the main bodysection 702. The micro channels 704 provide a continuous flow pathwayfor channeling the heat transfer fluid from the main body section 702.

The micro heatsink is produced by a series of steps to produce a preformof the micro heatsink, deposit a material including metal on thepreform, and remove the preform by thermal dissolution to complete themicro heatsink. Modeling is used to design the preform of the microheatsink. The modeling can be done by computer aided design,lithography, and/or stereo micro lithography. The depositing of amaterial that includes metal on the preform can be accomplished byelectrodeposition, electrophoretic deposition, and/or electrophoreticdeposition and plating for depositing the material on the preform. Theremoval of the preform can be accomplished by sintering the preform toremove the preform.

Referring now to FIGS. 8A, 8B and 8C; an example of a complex micro heatpipe array product produced by the inventor's system and method isillustrated. The three dimensional micro heat pipe is designatedgenerally by the reference numeral 800.

FIG. 8A shows a preform for the complex micro heat pipe product producedby the inventor's system and method. Modeling is used to design thepreform of the micro heat pipe. The modeling can be done by computeraided design, lithography, and/or stereo micro lithography.

FIG. 8B shows the depositing of a material that includes metal on thepreform 802. The material that includes metal is designated by thereference numeral 804. The depositing of a material that includes metalon the preform can be accomplished by electrodeposition, electrophoreticdeposition, and/or electrophoretic deposition and plating for depositingthe material on the preform.

The removal of the preform 802 can be accomplished by sintering thepreform to remove the preform. The removal of the preform 802 leavesmicro channels adapted to contain a heat pipe fluid.

FIG. 8C is a cut away view of the micro heat pipe 800. The micro heatpipe 800 includes the micro channels adapted to contain a heat pipefluid. Caps 806 close the micro channels 806.

Referring now to FIG. 9, a complex micro gas separation nozzle systemproduced by the inventor's method is illustrated. The micro gasseparation nozzle system is designated generally by the referencenumeral 900. The micro gas separation nozzle system 900 is the type ofaerodynamic nozzle invented and developed by E. W. Becker and hisassociates that has been one or the most successful of all theaerodynamic processes.

The micro gas separation nozzle system 900 includes a main body section902 and a multiplicity of individual nozzle modules in the main bodysection 902. A jet of gas consisting of roughly 96 percent hydrogen and4 percent UF₆ is allowed to expand through the narrow slits 904 of themultiplicity of nozzles in the main body 902. The gas moves at highspeeds (comparable to those at the periphery of a modern centrifuge)parallel to a semicircular wall of very small radius of curvature. Ifthe speed of the gas is 400 m/s, and the radius of curvature is 0.1 mm,then the centrifugal acceleration achieved is 1.6×10⁹ m/s² or 160million times gravity. The accelerations exceed even the high valuesachieved in centrifuges by a factor of a thousand or more, and they areachieved in an apparatus with no moving parts. The centrifugal forces onthe molecules cause the streamlines of the heavier components of the gasto move closer to the curved wall than those of the lighter componentsas the gas flows around the semicircle. At the other side, where the gashas changed direction by 180°, a sharp ‘skimmer’ separates the flow intoan inner light fraction and an outer heavy fraction.

The micro gas separation nozzle system 900 is produced by a series ofsteps to produce a preform of the micro gas separation nozzle system900, then deposit a material including metal on the preform, and finallyremove the preform by thermal dissolution to complete the micro gasseparation nozzle system 900. Modeling is used to design the preform ofthe micro gas separation nozzle system 900. The modeling can be done bycomputer aided design, lithography, and/or stereo micro lithography. Thedepositing of a material that includes metal on the preform and beaccomplished by electrodeposition, electrophoretic deposition, and/orelectrophoretic deposition and plating for depositing the material onthe preform. The removal of the preform can be accomplished by sinteringthe preform to remove the preform.

Referring to FIG. 10, a flow chart illustrates the inventor's system forproducing a micro heatsink using stereo micro lithography to produce apreform of the micro heatsink and using electrophoretic deposition fordepositing copper nanoparticles and diamond nanoparticles on saidpreform. The Inventor's system is designated generally by the referencenumeral 1000. Stereo micro lithography modeling is used to design athree dimensional preform of the micro heatsink. As illustrated in theflow chart of FIG. 10, the inventor's system includes a number of stepsin producing the micro heatsink.

In the step designated by the reference numeral 1002, a 3D solid modelof the micro heatsink is designed by any suitable method, e.g., by bitmapping or by computer aided design (CAD) software at a PC/controller.

In the step designated by the reference numeral 1004, the CAD model ofthe micro heatsink is electronically sliced into series of 2-dimensionaldata files, i.e., 2D layers, each defining a planar cross sectionthrough the micro heatsink to be constructed, and which may beindividually stored.

In the step designated by the reference numeral 1006, a digital image isprojected. A Lcos chip is used for the projection. In one example of theprojection, each 2D layer data is used to control a DMD display via thePC. A beam shutter, which may be an electronic or mechanical shutter, orany other type, is controlled by the PC and in turn controls a lightbeam which then travels through a beam homogenizer and a narrow bandfilter, impinging on a mirror of a prism to reflect therefrom to a DMDchip.

In the step designated by the reference numeral 1008, a UV beam isprojected.

In the step designated by the reference numeral 1010, a beam deliverysystem produces a beam containing the preform image information of themicro heat sink.

In the step designated by the reference numeral 1012, a beam projectionsystem projects the preform image in focus at a particular plane in aphotoresist/photo-curable composition to cure and completed the preformof the micro heat sink.

In the step designated by the reference numeral 1014, coppernanoparticles and diamond nanoparticles are deposited on the preform ofthe micro heat sink by electrophoretic deposition.

In the step designated by the reference numeral 1016, the preform isremoved to complete the micro heat sink. For example, the polymerpreform of the micro heat sink can be removed by sintering.

The Inventor's apparatus, systems, and methods have use producing acomplex heat sink. The heat sink has use in heat dissipation in powerelectronics, light emitting diodes and microchips. The heat sink has usein temperature regulation of a substrate.

Referring now to FIGS. 11A, 11B, and 11C; an embodiment of theinventor's complex heat sink product and the inventor's method forproducing a complex heat sink product are illustrated. This embodimentof the inventor's complex heat sink is designated generally by thereference numeral 1100.

FIG. 11A shows a preform for the complex heat sink product. Modeling isused to design the preform of the heat sink. The modeling can be done bycomputer aided design, lithography, and/or stereo micro lithography. Thepreform for the heat sink 1100 includes a first matrix section 1102, asecond matrix section 1104, and a connection section 1106.

FIG. 11B shows a complex micro heat sink product produced by theInventor's system and method. The micro heatsink includes a main bodysection 1108. The main body section 1108 includes a multiplicity ofinternal micro channels that correspond to the first matrix section1102, the second matrix section 1104, and the connection section 1106 ofthe preform shown in FIG. 11A. Holes 1110 and 1112 are drilled into themain body section 1108 to connect with the internal micro channels. Theholes 1110 and 1112 and the internal micro channels are adapted tochannel a heat transfer fluid to provide heat transfer.

FIG. 11C shows a cut away portion of the micro heat sink. As shown inFIG. 11C, the main body section 1102 includes micro channels 1114adapted to channel the heat transfer fluid to provide heat transfer fromthe main body section 1108. The micro channels 1104 provide a continuousflow pathway for channeling the heat transfer fluid through the mainbody section 1108.

The micro heatsink is produced by a series of steps to produce a preformof the micro heatsink, deposit a material including metal on thepreform, and remove the preform by thermal dissolution to complete themicro heatsink. Modeling is used to design the preform of the microheatsink. The modeling can be done by computer aided design,lithography, and/or stereo micro lithography. The depositing of amaterial that includes metal on the preform and be accomplished byelectrodeposition, electrophoretic deposition, and/or electrophoreticdeposition and plating for depositing the material on the preform. Theremoval of the preform can be accomplished by sintering the preform toremove the preform.

Referring to FIG. 12, a flow chart illustrates another embodiment of theinventor's system for producing a micro heatsink using stereo microlithography to produce a preform of the micro heatsink, usingelectrophoretic deposition for depositing diamond nanoparticles on thepreform, and using electroplating for depositing copper nanoparticles onthe preform. This embodiment of the inventor's system is designatedgenerally by the reference numeral 1200. Stereo micro lithographymodeling is used to design a three dimensional preform of the microheatsink. As illustrated in the flow chart of FIG. 12, the inventor'ssystem includes a number of steps in producing the micro heatsink.

In the step designated by the reference numeral 1202, a 3D solid modelof the micro heatsink is designed by any suitable method, e.g., by bitmapping or by computer aided design (CAD) software at a PC/controller.

In the step designated by the reference numeral 1204, the CAD model ofthe micro heatsink is electronically sliced into series of 2-dimensionaldata files, i.e., 2D layers, each defining a planar cross sectionthrough the micro heatsink to be constructed, and which may beindividually stored.

In the step designated by the reference numeral 1206, a digital image isprojected. A Lcos chip is used for the projection. In one example of theprojection, each 2D layer data is used to control a DMD display via thePC. A beam shutter, which may be an electronic or mechanical shutter, orany other type, is controlled by the PC and in turn controls a lightbeam which then travels through a beam homogenizer and a narrow bandfilter, impinging on a mirror of a prism to reflect therefrom to a DMDchip.

In the step designated by the reference numeral 1208, a UV beam isprojected.

In the step designated by the reference numeral 1212, a beam deliverysystem produces a beam containing the preform image information of themicro heat sink.

In the step designated by the reference numeral 1212, a beam projectionsystem projects the preform image in focus at a particular plane in aphotoresist/photo-curable composition to cure and completed the preformof the micro heat sink.

In the step designated by the reference numeral 1214, diamondnanoparticles are deposited on the preform of the micro heat sink byelectrophoretic deposition.

In the step designated by the reference numeral 1216, coppernanoparticles are deposited on the preform of the micro heat sink byelectroplating.

In the step designated by the reference numeral 1218, the preform isremoved to complete the micro heat sink. For example, the polymerpreform of the micro heat sink can be removed by sintering.

The Inventor's apparatus, systems, and methods have use producing acomplex heat sink. The heat sink has use in heat dissipation in powerelectronics, light emitting diodes and microchips. The heat sink has usein temperature regulation of a substrate.

Although the description above contains many details and specifics,these should not be construed as limiting the scope of the applicationbut as merely providing illustrations of some of the presently preferredembodiments of the apparatus, systems, and methods. Otherimplementations, enhancements and variations can be made based on whatis described and illustrated in this patent document. The features ofthe embodiments described herein may be combined in all possiblecombinations of methods, apparatus, modules, systems, and computerprogram products. Certain features that are described in this patentdocument in the context of separate embodiments can also be implementedin combination in a single embodiment. Conversely, various features thatare described in the context of a single embodiment can also beimplemented in multiple embodiments separately or in any suitablesubcombination. Moreover, although features may be described above asacting in certain combinations and even initially claimed as such, oneor more features from a claimed combination can in some cases be excisedfrom the combination, and the claimed combination may be directed to asubcombination or variation of a subcombination. Similarly, whileoperations are depicted in the drawings in a particular order, thisshould not be understood as requiring that such operations be performedin the particular order shown or in sequential order, or that allillustrated operations be performed, to achieve desirable results.Moreover, the separation of various system components in the embodimentsdescribed above should not be understood as requiring such separation inall embodiments.

Therefore, it will be appreciated that the scope of the presentapplication fully encompasses other embodiments which may become obviousto those skilled in the art. In the claims, reference to an element inthe singular is not intended to mean “one and only one” unlessexplicitly so stated, but rather “one or more.” All structural andfunctional equivalents to the elements of the above-described preferredembodiment that are known to those of ordinary skill in the art areexpressly incorporated herein by reference and are intended to beencompassed by the present claims. Moreover, it is not necessary for adevice to address each and every problem sought to be solved by thepresent apparatus, systems, and methods, for it to be encompassed by thepresent claims. Furthermore, no element or component in the presentdisclosure is intended to be dedicated to the public regardless ofwhether the element or component is explicitly recited in the claims. Noclaim element herein is to be construed under the provisions of 35U.S.C. 112, sixth paragraph, unless the element is expressly recitedusing the phrase “means for.”

While the apparatus, systems, and methods may be susceptible to variousmodifications and alternative forms, specific embodiments have beenshown by way of example in the drawings and have been described indetail herein. However, it should be understood that the application isnot intended to be limited to the particular forms disclosed. Rather,the application is to cover all modifications, equivalents, andalternatives falling within the spirit and scope of the application asdefined by the following appended claims.

The invention claimed is:
 1. A method of producing a complex product,the method comprising the steps of: designing a three dimensionalpreform of the complex product to form a model preform by computer aideddesign software at using a PC controller producing a computer aideddesign (CAD) model of said model preform, electronically slicing saidcomputer aided design (CAD) model into data files producing a digitalimage of said model preform, providing a photoresist/photo-curablecomposition, creating a three dimensional preform of the complex productusing said model preform by projecting said digital image of said modelpreform into said photoresist/photo-curable composition, depositingdiamond nanoparticles on said created three dimensional preform byelectrophoretic deposition, depositing copper nanoparticles on saidcreated three dimensional preform by electroplating, and removing thecreated three dimensional preform producing the complex product from thedeposited diamond nanoparticles material and deposited coppernanoparticles material.
 2. The method of producing a complex product ofclaim 1 wherein said step of projecting said digital image of said modelpreform into said photoresist/photo-curable composition comprises usinga light beam for projecting said digital image of said model preforminto said photoresist/photo-curable composition.
 3. The method ofproducing a complex product of claim 2 wherein said step of using alight beam for projecting said digital image of said model preform intosaid photoresist/photo-curable composition comprises using anultraviolet light beam for projecting said digital image of said modelpreform into said photoresist/photo-curable composition.
 4. The methodof producing a complex product of claim 2 wherein said step of using alight beam for projecting said digital image of said model preform intosaid photoresist/photo-curable composition comprises using a lcos chipfor using a light beam for projecting said digital image of said modelpreform into said photoresist/photo-curable composition.
 5. The methodof producing a complex product of claim 1 wherein said model preform isa polymer model preform.
 6. The method of producing a complex product ofclaim 5 wherein said step of removing the created three dimensionalpreform producing the complex product from the deposited materialcomprises using sintering for removing the created three dimensionalpolymer preform producing the complex product from the depositedmaterial.